Optical design, module assembly

WLO Stacked lens design；

WLO stacked lens and imaging chip CSP package；

The Dimensional Camera solution module consists of a WLO (wafer level optics) lens and CIS (CMOS image sensor) bonded with an outer layer covered with a black hood to form a complete miniature imaging module. This module can effectively reduce the volume space, and is suitable for micro camera application scenarios in small space.

Welcome light blanket, advanced lighting pattern optical design for vehicles, etc；